• DocumentCode
    1624148
  • Title

    Advances in power semiconductors and packaging lead to a compact integrated power stage for AC drives

  • Author

    Aftandilian, Leon ; Mangtani, Vijay ; Dubhashi, Ajit

  • Author_Institution
    Int.. Rectifier, El Segundo, CA, USA
  • fYear
    1997
  • Firstpage
    334
  • Lastpage
    339
  • Abstract
    Recent advances in semiconductor components and packaging (including areas like industrial modules, intelligent power modules, high-voltage ICs, and fully integrated power systems) offer motor control designers exciting new options for system integration that lead to lower-cost products with shorter design cycles. A POWIRTRAIN integrated power stage has been developed that offers an optimized combination of power semiconductors, gate driver, and system protections, all in an ultra-compact, plug and play drive system for AC induction motors. This paper discusses design philosophy and criteria, system block diagram and construction, and system specifications
  • Keywords
    driver circuits; induction motor drives; insulated gate bipolar transistors; integrated circuit packaging; power integrated circuits; semiconductor device packaging; AC drives; AC induction motors; POWIRTRAIN integrated power stage; compact integrated power stage; gate driver; high-voltage IC; industrial modules; intelligent power modules; packaging; power semiconductors; semiconductor components; system block diagram; system specifications; ultra-compact plug-and-play drive system; Electrical equipment industry; Industrial control; Industrial power systems; Lead compounds; Motor drives; Multichip modules; Power system control; Power system protection; Power systems; Semiconductor device packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wescon/97. Conference Proceedings
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-4303-4
  • Type

    conf

  • DOI
    10.1109/WESCON.1997.632358
  • Filename
    632358