DocumentCode
1624343
Title
High performance PC architecture design
Author
Oliver, D. John
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
1997
Firstpage
394
Lastpage
401
Abstract
Exploring the advantages and disadvantages of chipset BGA packaging with routing and layout tips often proves beneficial in PC architecture design. A detailed discussion about typical high performance embedded PC design considerations, like the identification and prioritization of critical layout paths and associated layout guidelines, typically aides in the success of most high speed Pentium (R) processor designs. Following these tried and true application suggestions should help to avoid most of the common pitfalls of designing high performance embedded Pentium(R) processor systems
Keywords
computer architecture; microcomputers; packaging; chipset BGA packaging; high performance PC architecture design; high speed embedded Pentium processor system; layout; routing; Assembly; Costs; Electronics packaging; Guidelines; Inspection; Pins; Printed circuits; Process design; Routing; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Wescon/97. Conference Proceedings
Conference_Location
Santa Clara, CA
ISSN
1095-791X
Print_ISBN
0-7803-4303-4
Type
conf
DOI
10.1109/WESCON.1997.632367
Filename
632367
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