• DocumentCode
    1624343
  • Title

    High performance PC architecture design

  • Author

    Oliver, D. John

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    1997
  • Firstpage
    394
  • Lastpage
    401
  • Abstract
    Exploring the advantages and disadvantages of chipset BGA packaging with routing and layout tips often proves beneficial in PC architecture design. A detailed discussion about typical high performance embedded PC design considerations, like the identification and prioritization of critical layout paths and associated layout guidelines, typically aides in the success of most high speed Pentium (R) processor designs. Following these tried and true application suggestions should help to avoid most of the common pitfalls of designing high performance embedded Pentium(R) processor systems
  • Keywords
    computer architecture; microcomputers; packaging; chipset BGA packaging; high performance PC architecture design; high speed embedded Pentium processor system; layout; routing; Assembly; Costs; Electronics packaging; Guidelines; Inspection; Pins; Printed circuits; Process design; Routing; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wescon/97. Conference Proceedings
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-4303-4
  • Type

    conf

  • DOI
    10.1109/WESCON.1997.632367
  • Filename
    632367