• DocumentCode
    162452
  • Title

    The influence of SiC/SiO2 interface morphology on the electrical characteristics of SiC MOS structures

  • Author

    Liu, L. ; Jiao, C. ; Xu, Yan ; Liu, Guo-Ping ; Feldman, L.C. ; Dhar, Sudipta

  • Author_Institution
    Dept. of Phys., Auburn Univ., Auburn, AL, USA
  • fYear
    2014
  • fDate
    13-15 Oct. 2014
  • Firstpage
    103
  • Lastpage
    106
  • Abstract
    The effect of roughness at the SiC/SiO2 interface on electrical properties of 4H-SiC MOS devices has been investigated. Variations in surface roughness were generated by annealing 4H-SiC samples at high temperatures (1550°C-1650°C) with or without a graphitic cap layer. Subsequently, gate oxides were grown on these surfaces for n-type MOS capacitors and n-channel MOSFETs were fabricated. Although the interfaces demonstrated significantly different surface morphology, interface state density (Dit) measured on the capacitors were almost identical. This was reflected in the MOSFET characteristics where, to first order, no obvious difference in field-effect mobility was observed. This result verifies that long range roughness (in the micron scale) does not affect mobility of channel electrons where the mean free path is of the order of a ~ 1 nm due to the low inversion layer mobility.
  • Keywords
    MOS capacitors; MOSFET; annealing; silicon compounds; surface morphology; surface roughness; MOS capacitors; MOS structures; SiC-SiO2; annealing; field effect mobility; graphitic cap layer; interface morphology; interface state density; n-channel MOSFET; surface morphology; surface roughness; temperature 1550 degC to 1650 degC; Annealing; Carbon; Rough surfaces; Surface morphology; Surface roughness; Surface treatment; Temperature measurement; 4H-SiC; interface states; mobility; roughness; surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2014 IEEE Workshop on
  • Conference_Location
    Knoxville, TN
  • Type

    conf

  • DOI
    10.1109/WiPDA.2014.6964633
  • Filename
    6964633