DocumentCode
162452
Title
The influence of SiC/SiO2 interface morphology on the electrical characteristics of SiC MOS structures
Author
Liu, L. ; Jiao, C. ; Xu, Yan ; Liu, Guo-Ping ; Feldman, L.C. ; Dhar, Sudipta
Author_Institution
Dept. of Phys., Auburn Univ., Auburn, AL, USA
fYear
2014
fDate
13-15 Oct. 2014
Firstpage
103
Lastpage
106
Abstract
The effect of roughness at the SiC/SiO2 interface on electrical properties of 4H-SiC MOS devices has been investigated. Variations in surface roughness were generated by annealing 4H-SiC samples at high temperatures (1550°C-1650°C) with or without a graphitic cap layer. Subsequently, gate oxides were grown on these surfaces for n-type MOS capacitors and n-channel MOSFETs were fabricated. Although the interfaces demonstrated significantly different surface morphology, interface state density (Dit) measured on the capacitors were almost identical. This was reflected in the MOSFET characteristics where, to first order, no obvious difference in field-effect mobility was observed. This result verifies that long range roughness (in the micron scale) does not affect mobility of channel electrons where the mean free path is of the order of a ~ 1 nm due to the low inversion layer mobility.
Keywords
MOS capacitors; MOSFET; annealing; silicon compounds; surface morphology; surface roughness; MOS capacitors; MOS structures; SiC-SiO2; annealing; field effect mobility; graphitic cap layer; interface morphology; interface state density; n-channel MOSFET; surface morphology; surface roughness; temperature 1550 degC to 1650 degC; Annealing; Carbon; Rough surfaces; Surface morphology; Surface roughness; Surface treatment; Temperature measurement; 4H-SiC; interface states; mobility; roughness; surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Wide Bandgap Power Devices and Applications (WiPDA), 2014 IEEE Workshop on
Conference_Location
Knoxville, TN
Type
conf
DOI
10.1109/WiPDA.2014.6964633
Filename
6964633
Link To Document