DocumentCode
1624761
Title
A Nanoindenter Based Method for Studying MEMS Contact Switch Microcontacts
Author
Gilbert, Kevin W. ; Mall, Shankar ; Leedy, Kevin D. ; Crawford, Bryan
Author_Institution
Air Force Inst. of Technol., Wright-Patterson AFB, OH
fYear
2008
Firstpage
137
Lastpage
144
Abstract
Physical and electrical processes involved in the lifecycle failure of metal contacts in MEMS RF cantilever beam contact switches are of a great interest to switch designers. The main failure of MEMS contact switches occurs at the metal contacts. This paper describes a specially designed nanoindenter based experimental setup for characterizing the physics and mechanics of MEMS scale electrical contacts when they are being cycled. The setup uses silicon cantilevers with contact bumps which are cycled mechanically to simulate the action of a MEMS contact switch. The cantilevers were sputter deposited with 300 nm of gold. Gold was investigated as the initial material of interest, as many current MEMS contact switches employ gold as a contact metal. The setup allows the physical evolution of the contact to be visually tracked and provides data on resistance, material property (e.g. strain hardening), and other changes in the contact behavior. Test data collected during a typical test includes contact adhesion force, contact stiffness change, resistance vs. cycles, and resistance vs. contact force relationships as a function of applied contact cycles. This paper provides details of this unique set-up and typical test results.
Keywords
beams (structures); cantilevers; electrical contacts; elemental semiconductors; failure analysis; gold; microswitches; nanofabrication; nanoindentation; silicon; sputter deposition; Au; MEMS RF cantilever beam; MEMS contact switch microcontacts; Si; contact adhesion force; contact bumps; contact force relationship; contact stiffness change; electrical contacts; gold; lifecycle failure analysis; metal contacts; nanoindenter; silicon cantilevers; size 300 nm; sputter deposition; Contact resistance; Gold; Inorganic materials; Micromechanical devices; Physics; Radio frequency; Silicon; Structural beams; Switches; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 2008. Proceedings of the 54th IEEE Holm Conference on
Conference_Location
Orlando, FL
Print_ISBN
978-1-4244-1901-2
Electronic_ISBN
978-1-4244-1902-9
Type
conf
DOI
10.1109/HOLM.2008.ECP.35
Filename
4694936
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