A one-dimensional thermal model for planar integrated reactive modules

Author

Zhao, L. ; Odendaal, W.G. ; Strydom, J.T. ; van Wyk, J.D.

Author_Institution

Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

4

fYear

2001

Firstpage

2211

Abstract

Thermal management is a key design aspect of planar integrated reactive modules. In this paper, a simple one-dimensional thermal model based on the control volume method is presented, which can be incorporated as an integral part of the design algorithm. It also requires significantly less computing time and resources than numerical software such as Flotherm. The simulation results and the experimental results are presented and compared in a case study.

Keywords

modules; thermal analysis; thermal conductivity; thermal management (packaging); L-C/L-C-T module; control volume method; module thickness; one-dimensional thermal model; planar integrated reactive modules; simulation; thermal conductivity; thermal management; volumetric heat generation; Algorithm design and analysis; Ceramics; Conducting materials; Energy management; Power electronics; Power system management; Power system modeling; Thermal conductivity; Thermal management; Tiles;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 2001. Thirty-Sixth IAS Annual Meeting. Conference Record of the 2001 IEEE

Conference_Location

Chicago, IL, USA

ISSN

0197-2618

Print_ISBN

0-7803-7114-3

Type

conf

DOI

10.1109/IAS.2001.955932

Filename

955932