Title :
Optimization of cycle time and utilization in semiconductor test manufacturing using simulation based, on-line, near-real-time scheduling system
Author :
Sivakumar, Appa Iyer
Author_Institution :
Gintic Inst. of Manuf. Technol., Nanyang Technol. Inst., Singapore
fDate :
6/21/1905 12:00:00 AM
Abstract :
A discrete event simulation based “on-line near-real-time” dynamic scheduling and optimization system has been conceptualized, designed, and developed to optimize cycle time and asset utilization in the complex manufacturing environment of semiconductor test manufacturing. Our approach includes the application of rules and optimization algorithm, using multiple variables as an integral part of discrete event simulation of the manufacturing operation and auto simulation model generation at a desired frequency. The system has been implemented at a semiconductor back-end site. The impact of the system includes the achievement of world class cycle time, improved machine utilization, reduction in the time that planners and manufacturing personnel spend on scheduling, and more predictable and highly repeatable manufacturing performance. In addition it enables managers and senior planners to carry out “what if” analysis to plan for future
Keywords :
discrete event simulation; manufacturing data processing; production control; real-time systems; scheduling; semiconductor device manufacture; auto simulation model generation; cycle time; discrete event simulation; dynamic scheduling; manufacturing environment; manufacturing performance; optimization system; semiconductor back-end site; semiconductor test manufacturing; simulation based online near-real-time scheduling system; utilization; what if analysis; Design optimization; Discrete event simulation; Dynamic scheduling; Frequency; Job shop scheduling; Personnel; Semiconductor device manufacture; Semiconductor device testing; System testing; Virtual manufacturing;
Conference_Titel :
Simulation Conference Proceedings, 1999 Winter
Conference_Location :
Phoenix, AZ
Print_ISBN :
0-7803-5780-9
DOI :
10.1109/WSC.1999.823204