Materials processing with atmospheric-pressure plasma jets

Summary form only given. Atmospheric-pressure plasma jets can be used for a wide range of materials processing applications, including surface cleaning and modification, selective etching, and thin-film deposition. The plasma source consists of two closely spaced electrodes through which helium and other gases flow (O/sub 2/, CF/sub 4/, etc.). A variety of electrode configurations can be used, and the source is suitable for continuous and large-area processing of materials. Another advantage of the plasma jet is that it achieves etching and deposition rates that are higher than those obtained in low-pressure plasmas. At the meeting, the plasma source will be described in detail, and results for several materials processing applications will be presented.