Title :
Design considerations for single package radio/spl trade/ (SPR) solution for EGSM/DCS dual band cellular phones
Author :
Megahed, M. ; Ngompe, E. ; Ayvazian, M. ; Glasbrener, M.
Author_Institution :
Skyworks Solution Inc., Newport Beach, CA, USA
Abstract :
A fully integrated front end radio on SPR, that provides a hybrid SOC and SIP solution, is presented. The SPR includes DCR transceiver, PA, directional coupler detector and FEM implemented on different die technologies plus discrete SAW, LPF, and diplexer in addition to embedded and discrete SMT components. The module is implemented on a low cost 4-layer MCM laminate substrate and its size is equal to 13/spl times/13/spl times/1.8 mm. The area saving on PCB phone boards by using the SPR is about 1/4 the discrete solution implementation. Results show that the complete radio integration can be successfully integrated on SPR.
Keywords :
UHF power amplifiers; cellular radio; multichip modules; surface mount technology; system-on-chip; transceivers; DCR transceiver; EGSM/DCS dual band cellular phones; LPF; PCB phone boards; SAW; area saving; complete radio integration; design considerations; die technologies; diplexer; directional coupler detector; discrete SMT components; embedded SMT components; front end module; fully integrated front end radio; hybrid SOC SIP solution; low cost 4-layer MCM laminate substrate; power amplifier; single package radio solution; system in package; system integration on chip; Cellular phones; Costs; Detectors; Directional couplers; Distributed control; Dual band; Packaging; Surface acoustic waves; Surface-mount technology; Transceivers;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1210468
