• DocumentCode
    1626773
  • Title

    6 to 17 GHz broadband high power amplifier using spatial power combining technique

  • Author

    Pengcheng Jia ; Lee-Yin Chen ; Alexanian, A. ; York, R.A.

  • Author_Institution
    CAP Wireless Inc, Newbury Park, CA, USA
  • Volume
    3
  • fYear
    2003
  • Firstpage
    1871
  • Abstract
    High power, broad bandwidth, high linearity and low noise are among the most important features in amplifier design. Broadband spatial power combining techniques address all these issues by combining the output power of a large quantity of microwave monolithic integrated circuit (MMIC) amplifiers in a broadband coaxial waveguide environment, while maintaining good linearity and improving phase noise of the MMIC amplifiers. A coaxial waveguide was used as the host of the combining circuits for broader bandwidth and better uniformity by equally distributing the input power to each element. A new compact coaxial combiner with much smaller size is investigated. Broadband slotline to microstrip line transitions are integrated for better compatibility with commercial MMIC amplifiers. Thermal simulations are performed and a new thermal management scheme is employed to improve the heat sinking in high power applications. A high power amplifier, using the compact combiner design, is built and demonstrated to have a bandwidth from 6 to 17 GHz with 44 W maximum output power. Linearity measurement has shown a high IP3 of 52 dBm.
  • Keywords
    MMIC power amplifiers; coaxial waveguides; heat sinks; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; microstrip transitions; phase noise; power combiners; slot line components; thermal management (packaging); 44 W; 6 to 17 GHz; IP3; MMIC amplifier phase noise; amplifier noise/linearity/bandwidth; broadband high power microwave amplifiers; broadband spatial power combining uniformity; compact coaxial waveguide combiner structures; element input power distribution; high power heat sinking; maximum output power; microwave monolithic integrated circuit amplifiers; slotline/microstrip line transitions; thermal management; Bandwidth; Broadband amplifiers; Coaxial components; High power amplifiers; Linearity; MMICs; Microwave amplifiers; Power amplifiers; Power generation; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2003 IEEE MTT-S International
  • Conference_Location
    Philadelphia, PA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7695-1
  • Type

    conf

  • DOI
    10.1109/MWSYM.2003.1210521
  • Filename
    1210521