Title :
Modeling requirements and techniques for plastic packages used in RFICs
Author :
Rafie-Hibner, Widad ; Brogan, Thomas
Author_Institution :
Harris Semicond., Melbourne, FL, USA
Abstract :
Successful RFIC designs in low cost plastic packages requires special design considerations to be applied in the areas of package selection and management of the parasitics the package introduces. Accurate modeling and characterization of the package is also a key ingredient in being successful in RFIC design. This paper describes the design considerations, modeling and verification processes used on an ultra high frequency transistor array housed in 16 lead SOIC plastic package
Keywords :
UHF integrated circuits; integrated circuit design; integrated circuit modelling; integrated circuit noise; plastic packaging; RFIC design; RFICs; SOIC plastic package; design verification processes; low cost plastic packages; modeling; modeling techniques; package characterization; package parasitics management; package selection; plastic packages; ultra high frequency transistor array; Bonding; Fixtures; Impedance; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Plastic packaging; Radio frequency; Radiofrequency integrated circuits; Scattering parameters;
Conference_Titel :
IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-8433-X
DOI :
10.1109/IPDI.1998.663638
