Title :
Self-aligned enhancement-mode AlGaN/GaN HEMTs using 25 keV fluorine ion implantation
Author :
Chen, Hongwei ; Wang, Maojun ; Chen, Kevin J.
Author_Institution :
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Abstract :
Owing to superior physical properties such as high electron saturation velocity and high electric breakdown field, GaN-based high electron mobility transistors (HEMTs) are capable of delivering superior performance in microwave amplifiers, high power switches, and high temperature integrated circuits (ICs). Compared to the conventional D-mode HEMTs with negative threshold voltages, enhancement-mode (E-mode) or normally-off HEMTs are desirable in these applications, for reduced circuit design complexity and fail-safe operation. Fluorine plasma treatment has been used to fabricate E-mode HEMTs, and is a robust process for the channel threshold voltage modulation. However, there is no standard equipment for this process and various groups have reported a wide range of process parameters . In this work, we demonstrate the self-aligned enhancement-mode AlGaN/GaN HEMTs fabricated with a standard fluorine ion implantation. Ion implantation is widely used in semiconductor industry with well-controlled dose and precise implantation profile.
Keywords :
III-V semiconductors; aluminium compounds; electric breakdown; fluorine; gallium compounds; high electron mobility transistors; ion implantation; AlGaN-GaN; E-mode HEMT; channel threshold voltage modulation; electric breakdown field; electron saturation velocity; fluorine ion implantation; fluorine plasma treatment; high electron mobility transistor; high power switch; high temperature integrated circuit; microwave amplifier; self-aligned enhancement-mode; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Silicon; Substrates;
Conference_Titel :
Device Research Conference (DRC), 2010
Conference_Location :
South Bend, IN
Print_ISBN :
978-1-4244-6562-0
Electronic_ISBN :
1548-3770
DOI :
10.1109/DRC.2010.5551879