• DocumentCode
    1627245
  • Title

    A novel effective surface impedance formulation for efficient broadband modeling of lossy thick strip conductors

  • Author

    Aosheng Rong ; Cangellaris, A.C. ; Limin Dong

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    3
  • fYear
    2003
  • Firstpage
    1959
  • Abstract
    A novel effective surface impedance is proposed for accurate modeling of the frequency-dependence of field penetration inside thick strip conductors. The proposed effective surface impedance is obtained through the rigorous modeling of the frequency-dependent cross-sectional field distribution in the interior of the lossy conductor, and is a function of both frequency and position along the perimeter of the cross section of the conductor. Availability of such an effective surface impedance enables the use of a surface integral equation formulation for the electromagnetic analysis of on-chip interconnects and integrated passives structures. Such formulations are much more efficient than volumetric ones without sacrificing accuracy in the modeling of the impact of conductor internal impedance and skin effect loss on the electromagnetic response. The validity of the proposed model is demonstrated through comparisons with measured scattering parameters for on-chip interconnect structures.
  • Keywords
    S-parameters; conductors (electric); integral equations; integrated circuit interconnections; skin effect; surface impedance; broadband model; cross-sectional field distribution; electromagnetic analysis; field penetration; frequency dependence; integrated passive structure; lossy thick strip conductor; on-chip interconnect; scattering parameters; skin effect; surface impedance; surface integral equation; Availability; Conductors; Electromagnetic analysis; Electromagnetic modeling; Frequency; Integral equations; Magnetic losses; Skin effect; Strips; Surface impedance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2003 IEEE MTT-S International
  • Conference_Location
    Philadelphia, PA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7695-1
  • Type

    conf

  • DOI
    10.1109/MWSYM.2003.1210542
  • Filename
    1210542