Title :
A compact transceiver for wide bandwidth and high power K-, Ka-, and V-band applications
Author :
Yamauchi, D. ; Quon, R. ; Yun-Ho Chung ; Nishimoto, M. ; Romo, C. ; Swift, J. ; Grundbacher, R. ; Lee, D. ; Liu, L.
Author_Institution :
Northrop Grumman Space Technol., Redondo Beach, CA, USA
Abstract :
Using the state-of-the-art InP MMICs and advanced packaging techniques, we demonstrated a compact transceiver with wide bandwidth (13% to 54%) and high power (over 500 mW) in covering K-, Ka and V-band operating frequencies. This module consists of over 30 MMICs and over 200 components and is considered to be the most complex module reported in the millimeter-wave frequencies. This work has laid a good foundation for combining MMIC and packaging technologies for a versatile millimeter-wave transceiver module.
Keywords :
III-V semiconductors; MMIC; indium compounds; integrated circuit packaging; transceivers; 500 mW; InP; InP MMIC; K-band; Ka-band; V-band; bandwidth; millimeter-wave transceiver module; output power; packaging technique; Bandwidth; Gain; MMICs; Millimeter wave technology; Packaging; Power generation; Radio frequency; Space technology; Switches; Transceivers;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1210555
