Shorting via arrays for the elimination of package resonance to reduce power supply noise in multi-layered area-array IC packages

Author

Fang, Jiayuan ; Zhao, Jin ; Zhang, Jingping

Author_Institution

Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA

fYear

1998

Firstpage

116

Lastpage

119

Abstract

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages. Properties of internal resonance in multilayered packages are studied. Effects of area-array power and ground vias of different densities are evaluated by examining the input impedances of the package power supply. It is shown that, by properly selecting the density of shorting via arrays, package resonance can be removed from a DC to multi-gigahertz frequency range

Keywords

electromagnetic fields; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; resonance; IC packages; area-array ground vias; area-array power vias; full-wave electromagnetic field simulation; ground noise; input impedance; internal resonance; multi-layered area-array IC packages; multilayered packages; package power supply; package resonance; package resonance removal; power noise; power supply noise; shorting via array density; shorting via arrays; via density; Capacitors; Circuit simulation; Computational modeling; Electromagnetic fields; Frequency; Integrated circuit noise; Integrated circuit packaging; Noise reduction; Power supplies; Resonance;

fLanguage

English

Publisher

ieee

Conference_Titel

IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-8433-X

Type

conf

DOI

10.1109/IPDI.1998.663642

Filename

663642