Title :
Shorting via arrays for the elimination of package resonance to reduce power supply noise in multi-layered area-array IC packages
Author :
Fang, Jiayuan ; Zhao, Jin ; Zhang, Jingping
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages. Properties of internal resonance in multilayered packages are studied. Effects of area-array power and ground vias of different densities are evaluated by examining the input impedances of the package power supply. It is shown that, by properly selecting the density of shorting via arrays, package resonance can be removed from a DC to multi-gigahertz frequency range
Keywords :
electromagnetic fields; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; resonance; IC packages; area-array ground vias; area-array power vias; full-wave electromagnetic field simulation; ground noise; input impedance; internal resonance; multi-layered area-array IC packages; multilayered packages; package power supply; package resonance; package resonance removal; power noise; power supply noise; shorting via array density; shorting via arrays; via density; Capacitors; Circuit simulation; Computational modeling; Electromagnetic fields; Frequency; Integrated circuit noise; Integrated circuit packaging; Noise reduction; Power supplies; Resonance;
Conference_Titel :
IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-8433-X
DOI :
10.1109/IPDI.1998.663642
