Title :
Inductance-enhanced high-impedance surfaces for broadband simultaneous switching noise mitigation in power planes
Author :
Kamgaing, T. ; Ramahi, O.M.
Author_Institution :
Semicond. Products Sector, Motorola Inc., Tempe, AZ, USA
Abstract :
Full wave electromagnetic simulation is used to study the application of high-impedance surfaces (HIS) in simultaneous switching noise (SSN) mitigation in power planes. The impact of the geometry on the performance of power planes with simple and inductance-enhanced HIS is investigated. A lumped-element compact model form, applicable to both types of power planes is developed. Good agreement is obtained between the modeled and simulated S-parameters of the power planes from DC to 4 GHz.
Keywords :
S-parameters; circuit noise; circuit simulation; electromagnetic interference; finite element analysis; frequency response; inductance; lumped parameter networks; printed circuit design; surface impedance; 0 to 4 GHz; FEM based simulator; S-parameters; broadband simultaneous switching noise mitigation; frequency response; full wave electromagnetic simulation; inductance-enhanced high-impedance surfaces; lumped-element compact model; multilayer printed circuit boards; patch separation; power planes; via length; Capacitors; Circuit simulation; Electromagnetic waveguides; Periodic structures; Power system modeling; Resonance; Semiconductor device noise; Surface waves; Switches; Voltage;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1210592
