Title : 
Microelectronics in the “More than Moore” era
         
        
            Author : 
Wise, Kensall D.
         
        
            Author_Institution : 
Center for Wireless Integrated Microsyst., Univ. of Michigan, Ann Arbor, MI, USA
         
        
        
        
        
            Abstract : 
As we move beyond scaling ("More Moore") to attack critical problems in health care, the environment, infrastructure, security, and energy, microsystems will be required that combine low-power micro-electronics with sensing, wireless interfaces, advanced packaging, and energy scavenging. They will create major new markets, ushering in what has been called the "More than Moore" era.
         
        
            Keywords : 
integrated circuits; low-power electronics; advanced packaging; energy scavenging; low-power microelectronics; more than Moore era; sensing; wireless interface; Actuators; Biomarkers; Communication system security; Silicon; Software; Wireless communication; Wireless sensor networks;
         
        
        
        
            Conference_Titel : 
Device Research Conference (DRC), 2010
         
        
            Conference_Location : 
South Bend, IN
         
        
        
            Print_ISBN : 
978-1-4244-6562-0
         
        
            Electronic_ISBN : 
1548-3770
         
        
        
            DOI : 
10.1109/DRC.2010.5551936