• DocumentCode
    1628816
  • Title

    Advanced methods for silicon device modeling

  • Author

    Ravaioli, Umberto

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2010
  • Firstpage
    168
  • Lastpage
    171
  • Abstract
    The sustained development of digital electronics has driven for many years the advances of silicon device simulation. However, fundamental simulation issues that must be addressed in modern digital devices are also quite relevant for high frequency applications. Quantum effects must be considered in the simulation of aggressively scaled structures, while thermal effects are particular relevant for power applications. Conventional simulation approaches based on the standard semiconductor equations, although computationally efficient, do not always provide a sufficiently predictive model. More advanced physical approaches rely on an extended Boltzmann equation model that can include explicitly the detailed band structure, nonlinear transport effects, quantum corrections and a self-consistent treatment for self-heating and phonon transport. Such complicated physical models are more easily implemented in particle Monte Carlo simulation.
  • Keywords
    Boltzmann equation; Monte Carlo methods; semiconductor device models; Boltzmann equation; Monte Carlo simulation; digital electronics; quantum effects; silicon device modeling; silicon device simulation; standard semiconductor equations; Boltzmann equation; Computational modeling; Nonlinear equations; Particle scattering; Phonons; Predictive models; Quantization; Quantum mechanics; Scattering parameters; Silicon devices; Monte Carlo simulation; band structure; non-linear transport; quantum effects; self-heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2010 Topical Meeting on
  • Conference_Location
    New Orleans, LA
  • Print_ISBN
    978-1-4244-5456-3
  • Type

    conf

  • DOI
    10.1109/SMIC.2010.5422994
  • Filename
    5422994