DocumentCode
1629421
Title
Liquid crystal polymer (LCP) for microwave/millimeter wave multilayer packaging
Author
Wei, Z. ; Pham, A.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
Volume
3
fYear
2003
Firstpage
2273
Abstract
This paper presents characterization and analysis of liquid crystal polymer materials for microwave and millimeter multi-layer packaging. Processing techniques have been developed to fabricate interconnects on this new LCP material. The experimental results demonstrate that an interconnect on LCP achieves a measured insertion loss of less than 0.1 dB/mm up to 50 GHz. This material is highly suitable for microwave and millimeter wave packaging.
Keywords
coplanar waveguides; interconnections; liquid crystal polymers; packaging; 50 GHz; coplanar waveguide transmission line; insertion loss; interconnect fabrication; liquid crystal polymer; microwave multilayer packaging; millimeter-wave multilayer packaging; Coplanar waveguides; Crystalline materials; Crystallization; Fabrication; Gold; Integrated circuit interconnections; Liquid crystal polymers; Millimeter wave measurements; Millimeter wave technology; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location
Philadelphia, PA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7695-1
Type
conf
DOI
10.1109/MWSYM.2003.1210619
Filename
1210619
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