DocumentCode
1629542
Title
Highly scalable vertical bandgap-engineered NAND flash memory
Author
Cho, Seongjae ; Kim, Yoon ; Shim, Won Bo ; Li, Dong Hua ; Lee, Jong-Ho ; Shin, Hyungcheol ; Park, Byung-Gook
Author_Institution
Inter-Univ. Semicond. Res. Center (ISRC), Seoul Nat. Univ., Seoul, South Korea
fYear
2010
Firstpage
265
Lastpage
266
Abstract
In this work, highly scalable charge trap flash (CTF) memory with bandgap-engineered storage node and vertical channel is proposed. Due to the compact cell layout without individual junction contacts, NAND flash memory has the most suitable architecture for mobile data storage media. In other to achieve even higher integration density, two NAND flash memory cells in the conventional sting are put together to have a common vertical channel. Highly scalable vertical BE-NAND flash memory has been successfully fabricated and the conditions for reliable operation have been investigated. The excellent performances of the proposed flash memory demonstrate that it has the feasibility and potential for the advanced 3-D flash memory applications.
Keywords
NAND circuits; flash memories; advanced 3D flash memory; bandgap-engineered storage node; high scalable vertical bandgap-engineered NAND flash memory; mobile data storage media; vertical channel; Educational institutions;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2010
Conference_Location
South Bend, IN
ISSN
1548-3770
Print_ISBN
978-1-4244-6562-0
Electronic_ISBN
1548-3770
Type
conf
DOI
10.1109/DRC.2010.5551967
Filename
5551967
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