Title :
1mW 4-5GHz packaged VCO with bonding-to-ground inductors
Author :
Shi, Congyin ; Ye, Le ; Liu, Junhua
Author_Institution :
SOI Group, Peking Univ., Beijing, China
Abstract :
A packaged VCO, which utilizes the heat-sink pad in Quad Flat Pack No-Lead (QFN) package to provide a ground connection for bonding wire inductors, is presented in this paper. The proposed VCO is designed to cover 4 to 5 GHz band and is able to work under a minimum of 0.9 V DC supply voltage with only 1 mW power consumption. It is fabricated in 0.18 μm standard CMOS process. It achieves the FOM of -193 dBc/Hz, and the measured frequency variation is less than 11%.
Keywords :
CMOS analogue integrated circuits; MMIC oscillators; bonding processes; electronics packaging; field effect MMIC; heat sinks; inductors; low-power electronics; voltage-controlled oscillators; CMOS process; DC supply voltage; QFN package; bonding wire inductor; bonding-to-ground inductor; frequency 4 GHz to 5 GHz; packaged VCO; power 1 mW; power consumption; quad flat pack no-lead package; Bonding; Frequency measurement; Inductance; Inductors; Silicon; Voltage-controlled oscillators; Wire;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5797-7
DOI :
10.1109/ICSICT.2010.5667376
