DocumentCode :
1630242
Title :
Silicon neural information transducers: current technology, perspectives, and recent results
Author :
Edell, David J. ; Clark, Lloyd D., Jr.
Author_Institution :
MIT, Cambridge, MA, USA
fYear :
1989
Firstpage :
937
Abstract :
Advanced neural information transducers are currently under development. Novel micromachined silicon transducer fabrication techniques have been created to facilitate construction of implantable devices which can achieve a high-quality, long-term, neural-electrical interface. The basic functionality of implanted microtransducers has been demonstrated during long-term implants. Current research is focused on the study of the interface during behavioral testing of implanted animals, methods of optimizing information transduction, adaptive detection and encoding circuitry, understanding the electrical properties of the microenvironment surrounding the contacts, and techniques for fabrication of active devices that can function indefinitely during saline immersion. Applications of existing technology are not technically possible for physiological studies and relatively short-term feasibility testing in humans. New understanding of protection of integrated circuits during long-term saline immersion is essential for implementation of advanced long-term integrated systems
Keywords :
biological techniques and instruments; biomedical electronics; neurophysiology; reviews; transducers; Si neural information transducers; behavioral testing; high-quality long-term neural-electrical interface; implantable devices; implanted animals; implanted microtransducers; integrated circuits protection; microenvironment electrical properties; neurobiology; rehabilitation; saline immersion; Animals; Circuit testing; Contacts; Encoding; Fabrication; Implants; Integrated circuit technology; Optimization methods; Silicon; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 1989. Images of the Twenty-First Century., Proceedings of the Annual International Conference of the IEEE Engineering in
Conference_Location :
Seattle, WA
Type :
conf
DOI :
10.1109/IEMBS.1989.95625
Filename :
95625
Link To Document :
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