• DocumentCode
    1631007
  • Title

    Reusable burn-in carrier system for cut die

  • Author

    Levy, Paul S.

  • Author_Institution
    VLSI Technol. Inc., Tempe, AZ, USA
  • fYear
    1994
  • Firstpage
    363
  • Lastpage
    365
  • Abstract
    This paper details a proposed system for burning in sorted die. The system described allows sorted diced die to be electrically stressed at high temperatures for a typical burn-in cycle. Furthermore the system allows the die to be re-screened after the burn-in cycle is completed.
  • Keywords
    life testing; multichip modules; production testing; MCMs; burn-in cycle; cut die; electrical stress; reusable burn-in carrier system; sorted die; Bonding; Flexible electronics; Manufacturing; Packaging; Pins; Polymer films; Rivers; Substrates; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Southcon/94. Conference Record
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    0-7803-9988-9
  • Type

    conf

  • DOI
    10.1109/SOUTHC.1994.498133
  • Filename
    498133
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1631007