Title :
3D IC testing using a chip prober and a transparent membrane probe card
Author :
Watanabe, N. ; Aoyagi, Masahiro ; Eto, Masamichi ; Kawano, Katsumi
Author_Institution :
Nano-Electron. Res. Inst., Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
Abstract :
We performed pre- and post-bond testing of static random access memory (SRAM)/flash memory chips using a chip prober with a transparent membrane probe card. By deformation of the polyethylene naphthalate film (base material of the probe card) during probing, low-load and damage-less probing was possible, and we successfully conducted pre-bond testing of 30-50-μm-thick SRAM/flash memory chips and post-bond testing of stacked chips.
Keywords :
SRAM chips; deformation; flash memories; integrated circuit testing; polymer films; probes; three-dimensional integrated circuits; 3D IC testing; SRAM; chip prober; damage-less probing; flash memory chips; low-load probing; polyethylene naphthalate film deformation; post-bond testing; pre-bond testing; size 30 mum to 50 mum; stacked chips; static random access memory; transparent membrane probe card; Films; Flash memories; Probes; Random access memory; Stacking; Testing; Voltage measurement; chip prober; polyethylene naphthalate (PEN) film; post-bond testing; pre-bond testing; three-dimensional integrated circuit; transparent membrane probe card;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2014 International Conference on
Conference_Location :
Udine
Print_ISBN :
978-1-4799-2193-5
DOI :
10.1109/ICMTS.2014.6841474
