• DocumentCode
    1631334
  • Title

    Planning for production of a set of components when yield is random

  • Author

    Singh, Medini R. ; Abraham, Chacko T. ; Akella, Ram

  • Author_Institution
    Graduate Sch. of Ind. Adm., Carnegie-Mellon Univ., Pittsburgh, PA, USA
  • fYear
    1988
  • Firstpage
    196
  • Lastpage
    200
  • Abstract
    Random yield in semiconductor manufacturing poses a major challenge for production planning. The task becomes even more difficult if the demand is in terms of a set of components. Here, model are presented which explicitly take account of yield losses and show how available chip sites should be allocated among various types of chips to meet the demand of a set with the maximum probability. This allocation model also provides tradeoff curves between the number of chip sites assigned for the production of a set and the highest attainable level of confidence in meeting the demand. The models presented here can be used at the aggregate production planning stage where jobs have to be released into the fabrication line based on demands.<>
  • Keywords
    integrated circuit manufacture; scheduling; aggregate production planning stage; allocation model; chip sites allocation; fabrication line; highest attainable level of confidence; maximum probability; number of chip sites assigned; production planning; random yield; semiconductor manufacturing; set of components; tradeoff curves; yield losses; Aggregates; Assembly; Computer aided manufacturing; Fabrication; Job production systems; Manufacturing industries; Meeting planning; Production planning; Semiconductor device manufacture; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
  • Conference_Location
    Lake Buena Vista, FL, USA
  • Type

    conf

  • DOI
    10.1109/EMTS.1988.16176
  • Filename
    16176