Title :
Test structure to evaluate the impact of neighboring features on stress of metal interconnects
Author :
Smith, Brian ; Shroff, Mohit
Author_Institution :
Freescale Semicond., Inc., Austin, TX, USA
Abstract :
The stress-inducing effects of neighboring metal interconnect features were studied using novel stressmigration test structures with various layouts of perpendicular neighboring combs. The structures with narrow widths showed no change in stressmigration performance, with or without near-neighbor structures. However, structures built with wider lines showed up to 3X worse stressmigration performance when perpendicular combs were present nearby, essentially independent of the spacing to the combs. Thus, near neighbor metal features were shown to be capable of degrading SM performance in some lines.
Keywords :
integrated circuit interconnections; integrated circuit layout; integrated circuit testing; micromechanical devices; thermal stresses; SM performance degradation; near neighbor metal features; near-neighbor structures; neighboring metal interconnect; perpendicular neighboring comb layout; stress-induced voiding; stress-inducing effects; stress-migration test structures; thermal stress; Aerospace electronics; Layout; Metals; Resistance; Stress; Stress measurement; Temperature measurement; stress; test structure; voiding;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2014 International Conference on
Conference_Location :
Udine
Print_ISBN :
978-1-4799-2193-5
DOI :
10.1109/ICMTS.2014.6841495