DocumentCode
1631684
Title
Session Abstract
Author
Zorian, Y. ; Kim, Bumki
Author_Institution
Virage Logic
fYear
2006
Firstpage
334
Lastpage
335
Abstract
Today’s system-in-package (SiP) technology involves the system integration of multiple die from various technologies into a common package. This session will present SiP applications and their design and test practices from the major SiP companies. The presentations include issues for SiP, and trade-offs between SiP vs. POP vs. SOC integration for cell phone applications.
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 2006. Proceedings. 24th IEEE
Print_ISBN
0-7695-2514-8
Type
conf
DOI
10.1109/VTS.2006.65
Filename
1617613
Link To Document