• DocumentCode
    1632303
  • Title

    Study on the actuating performance of NiTi/Si composite film

  • Author

    Sun Shuangshuang ; Liu XiaoHui

  • Author_Institution
    Dept. of Electro-Mech. Eng., Qingdao Univ. of Sci. & Technol., Qingdao, China
  • fYear
    2010
  • Firstpage
    224
  • Lastpage
    228
  • Abstract
    On the basis of considering the material nonlinearity of shape memory alloys, the mechanical model of the shape memory alloy composite film based on Si substrate is established by the method of mechanics of materials to study the coupled action between the shape memory alloy and Si substrate under thermal loads. The actuating performances of the SMA composite film are simulated and discussed for one whole thermal loading cycle, which verifies that large actuating forces and displacements can be produced in the narrow temperature range due to the phase transformations of shape memory alloys. It is also found that the maximum deflection of the composite film decreases with the increasing of the thickness ratio of the Si substrate to the shape memory alloy film. And the mechanical model established in this paper can describe and predict the actuating performances of the SMA composite film much more accurately when the thickness ratios are larger than five.
  • Keywords
    composite materials; microactuators; nickel alloys; semiconductor-metal boundaries; shape memory effects; silicon; solid-state phase transformations; titanium alloys; NiTi-Si; NiTi/Si composite film; actuating forces; actuating performance; displacements; material mechanics; material nonlinearity; maximum deflection; mechanical model; narrow temperature range; phase transformations; shape memory alloys; silicon substrate; thermal loading cycle; thickness ratio; Films; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Embedded Systems and Applications (MESA), 2010 IEEE/ASME International Conference on
  • Conference_Location
    Qingdao
  • Print_ISBN
    978-1-4244-7101-0
  • Type

    conf

  • DOI
    10.1109/MESA.2010.5552070
  • Filename
    5552070