• DocumentCode
    1632578
  • Title

    The influence of water absorption on dielectric properties of cycloaliphatic epoxy resin

  • Author

    Fukuda, A. ; Mitsui, H. ; Inoue, Y. ; Goto, K.

  • Author_Institution
    Heavy Apparatus Eng. Lab., Toshiba Corp., Yokohama, Japan
  • Volume
    1
  • fYear
    1997
  • Firstpage
    58
  • Abstract
    The study was performed to investigate interfacial phenomena between fillers and resin in composite insulation materials. Relative permittivity εr and loss tangent tan δ of cycloaliphatic epoxy resin filled with silica powders (CEP) and non-filled resin (EP) were measured under dry and wet conditions. It is shown that for CEP εr and tan δ drastically increase with water absorption, but for EP they are hardly influenced by water absorption, even though EP absorbs water. Therefore, the ε r and tan δ values of water-absorbed CEP are discussed assuming that a thin water layer formed around the filler as a shell. We can describe the complex permittivity of the water-absorbed CEP with the expanded Wagner´s equation and obtain the relationship between ε r or tan δ and water-layer thickness from the equation. By the comparison of the calculated and experimental results, consequently, we concluded that water is absorbed in and near the interface between the fillers and resin and then the interfacial polarization in the area is emphasized and brings about the increases of εr and tan δ for water-absorbed CEP
  • Keywords
    dielectric losses; environmental degradation; epoxy insulation; filled polymers; permittivity; water; H2O; SiO2; complex permittivity; composite insulation materials; cycloaliphatic epoxy resin; dielectric properties; dry conditions; expanded Wagner equation; fillers; interfacial phenomena; interfacial polarization; loss tangent; non-filled resin; relative permittivity; silica powders; thin water layer; water absorption; water-absorbed CEP; water-layer thickness; wet conditions; Absorption; Composite materials; Dielectric loss measurement; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Equations; Permittivity; Silicon compounds; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    0-7803-2651-2
  • Type

    conf

  • DOI
    10.1109/ICPADM.1997.617527
  • Filename
    617527