DocumentCode :
1632675
Title :
A bulk acoustic wave resonator for sensing liquid electrical property changes
Author :
Zhang, Chao ; Vetelino, John F.
Author_Institution :
Lab. for Surface Sci. & Technol., Maine Univ., Orono, ME, USA
fYear :
2001
fDate :
6/23/1905 12:00:00 AM
Firstpage :
535
Lastpage :
541
Abstract :
A thickness shear mode (TSM) bulk acoustic wave (BAW) sensor for liquid electrical property (conductivity and dielectric constant) measurements is presented. This sensor, which is configured as a resonator structure, employs a sensing electrode geometry, which allows the accurate measurement of the liquid electrical properties. The frequency response of the sensor has been measured in both conductive (NaCl) and non-conductive (2-proponal) solutions. A theoretical model has been developed to describe the sensor operating in liquids and the calculated impedance is shown to agree well with the measured impedance. The sensitivity of this sensor to the change in liquid dielectric constant has been determined. Compared with other sensing technologies, the present sensor may provide a more reliable, portable and low cost solution for on-line monitoring of the liquid electrical property changes
Keywords :
acoustic analysis; bulk acoustic wave devices; crystal resonators; electrical conductivity measurement; equivalent circuits; frequency response; permittivity measurement; 2-proponal solutions; AT-cut sensors; bulk acoustic wave resonator; conductive solutions; dielectric constant; electrical conductivity; equivalent circuit models; frequency response; liquid electrical property measurements; on-line monitoring; quartz sensors; sensing electrode geometry; thickness shear mode BAW sensor; Acoustic measurements; Acoustic sensors; Acoustic waves; Conductivity measurement; Dielectric constant; Dielectric measurements; Electric variables measurement; Electrodes; Impedance; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium and PDA Exhibition, 2001. Proceedings of the 2001 IEEE International
Conference_Location :
Seattle, WA
ISSN :
1075-6787
Print_ISBN :
0-7803-7028-7
Type :
conf
DOI :
10.1109/FREQ.2001.956336
Filename :
956336
Link To Document :
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