DocumentCode :
1632687
Title :
Mini environment systems. Enabling technology for flexible fabs of the future
Author :
Baldwin, Kevin ; Castrucci, Paul ; Williams, Malcolm
Author_Institution :
Asyst Technol., Milpitas, CA, USA
fYear :
1994
Firstpage :
10
Abstract :
Summary form only given. As the industry moves from one generation of IC technology to the next with smaller and smaller submicron devices and larger and larger wafers, severe constraints will be placed on manufacturing fabs. Conventional fabs typically have four generations of product running at once: advanced technology in development; growing technology ramping-up; current technology at its peak; and one generation declining and going out. Fab flexibility will be a key requirement as technological changes demand substantial tooling changes. We will describe a Minienvironment System that integrates the many tooling and process requirements the “Fab of the Future”
Keywords :
integrated circuit manufacture; IC technology; flexible fabs of the future; manufacturing; mini environment systems; submicron devices; tooling; wafer processing; Manufacturing industries; Manufacturing processes; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-2053-0
Type :
conf
DOI :
10.1109/ASMC.1994.588155
Filename :
588155
Link To Document :
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