• DocumentCode
    1632938
  • Title

    Temperature coefficient and ageing of BAW composite materials

  • Author

    Lakin, K.M. ; McCarron, K.T. ; McDonald, J.F. ; Belsick, J.

  • Author_Institution
    TFR Technol. Inc., Bend, OR, USA
  • fYear
    2001
  • fDate
    6/23/1905 12:00:00 AM
  • Firstpage
    605
  • Lastpage
    608
  • Abstract
    Thin film resonators have been made that exhibit a high degree of temperature compensation. These resonators are composed of piezoelectric aluminum nitride films, aluminum top and bottom electrodes, and are compensated with layers of silicon dioxide within the resonator. The resonators are fabricated with the solidly mounted resonator (SMR) configuration using a sequence of aluminum nitride and silicon dioxide reflector layers. Silicon dioxide has a positive temperature coefficient and can be used to offset the -25 ppm per degree C temperature coefficient of aluminum nitride. Results are reported on hermetic packaging, temperature cycle testing, temperature coefficient measurements, and preliminary ageing. This paper reports on progress made in ageing studies and temperature cycling of 644 MHz temperature compensated resonators
  • Keywords
    acoustic resonators; ageing; aluminium compounds; bulk acoustic wave devices; laminates; piezoelectric thin films; seals (stoppers); thermal management (packaging); 644 MHz; AlN; BAW composite materials; ageing studies; composite resonator; hermetic packaging; piezoelectric films; positive temperature coefficient; solidly mounted resonator configuration; temperature compensation; temperature cycle testing; thin film resonators; Aging; Aluminum nitride; Composite materials; Electrodes; Optical films; Packaging; Piezoelectric films; Semiconductor films; Silicon compounds; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium and PDA Exhibition, 2001. Proceedings of the 2001 IEEE International
  • Conference_Location
    Seattle, WA
  • ISSN
    1075-6787
  • Print_ISBN
    0-7803-7028-7
  • Type

    conf

  • DOI
    10.1109/FREQ.2001.956347
  • Filename
    956347