DocumentCode
1632977
Title
Empirical process model for arsenic diffusion in Si1−x Gex alloys
Author
Sharma, Abhishek A. ; Mane, Sanjay S.
Author_Institution
Dept. of Electron., Sardar Patel Inst. of Technol., Mumbai, India
fYear
2010
Firstpage
956
Lastpage
959
Abstract
The thermal diffusion behavior of ion-implanted Arsenic (As) in SiGe alloy has been investigated and modeled. This paper introduces an empirical model consisting of physics-based and process parameters for evaluating the effective diffusivity of Arsenic through SiGe accurately. The process parameters that were found to dominate the enhancement in arsenic diffusion were the Germanium content, diffusion temperature and the anneal time. The model was validated for the germanium content of up to 45% with the reported data and the existing simulation models in Silvaco. The model incorporates all the effects associated with the change in the process parameters which affect the diffusivity of As in relaxed-SiGe.
Keywords
arsenic; ion implantation; silicon alloys; thermal diffusion; SiGe; SiGe alloy; anneal time; arsenic diffusion; diffusion temperature; empirical process model; germanium content; ion-implanted arsenic; thermal diffusion behavior; Annealing; Equations; Germanium; Mathematical model; Silicon; Silicon germanium; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667497
Filename
5667497
Link To Document