• DocumentCode
    1632977
  • Title

    Empirical process model for arsenic diffusion in Si1−xGex alloys

  • Author

    Sharma, Abhishek A. ; Mane, Sanjay S.

  • Author_Institution
    Dept. of Electron., Sardar Patel Inst. of Technol., Mumbai, India
  • fYear
    2010
  • Firstpage
    956
  • Lastpage
    959
  • Abstract
    The thermal diffusion behavior of ion-implanted Arsenic (As) in SiGe alloy has been investigated and modeled. This paper introduces an empirical model consisting of physics-based and process parameters for evaluating the effective diffusivity of Arsenic through SiGe accurately. The process parameters that were found to dominate the enhancement in arsenic diffusion were the Germanium content, diffusion temperature and the anneal time. The model was validated for the germanium content of up to 45% with the reported data and the existing simulation models in Silvaco. The model incorporates all the effects associated with the change in the process parameters which affect the diffusivity of As in relaxed-SiGe.
  • Keywords
    arsenic; ion implantation; silicon alloys; thermal diffusion; SiGe; SiGe alloy; anneal time; arsenic diffusion; diffusion temperature; empirical process model; germanium content; ion-implanted arsenic; thermal diffusion behavior; Annealing; Equations; Germanium; Mathematical model; Silicon; Silicon germanium; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667497
  • Filename
    5667497