DocumentCode
1633366
Title
Scaling of EOT beyond 0.5nm
Author
Ahmet, P. ; Kitayama, D. ; Kaneda, T. ; Suzuki, T. ; Koyanagi, T. ; Kouda, M. ; Mamatrishat, M. ; Kawanago, T. ; Kakushima, K. ; Iwai, H.
Author_Institution
Frontier Res. Center, Tokyo Inst. of Technol., Yokohama, Japan
fYear
2010
Firstpage
994
Lastpage
996
Abstract
In this paper, we report our approaches in realizing EOT of 0.5nm and below with rare earth La2O3 high-k gate dielectric. An EOT of 0.43nm was obtained from a TiN/W/La2O3(3nm)/n-Si capacitor by optimizing the thickness W layer. Our results show that a proper gate electrode is one of the most important factors for realizing EOT below 0.5nm.
Keywords
MOSFET; capacitors; electrodes; high-k dielectric thin films; lanthanum compounds; semiconductor thin films; EOT scaling; La2O3; MOSFET; capacitor; gate electrode; high-k gate dielectric; rare earth; size 0.43 nm; Annealing; Dielectrics; High K dielectric materials; Logic gates; Silicon; Thermal stability; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667512
Filename
5667512
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