Title :
Flow and warpage simulation of mobile phone injection mold
Author_Institution :
Sch. of Inf. Sci. & Technol., TSU, Taian, China
Abstract :
In order to improve the injection quality of mobile phone, The CAE theory of injection molding is studied and the flow and warpage simulation is undertaken based on the Moldflow software. After the filling and warpage simulation, the defects in the plastic part are fond and the injection parameter and the shell structure is improved. The results show that the tryout time is saved and the design efficiency of the injection mold is improved.
Keywords :
electronics packaging; flow simulation; injection moulding; mechanical engineering computing; mobile handsets; plastic flow; production engineering computing; CAE theory; Moldflow software; flow simulation; injection quality; mobile phone injection mold; plastic part defects; warpage simulation; Filling; Mathematical model; Mobile handsets; Plastics; Software; Solid modeling; Welding; flow; injection mold; simulation; warpage;
Conference_Titel :
Instrumentation & Measurement, Sensor Network and Automation (IMSNA), 2012 International Symposium on
Conference_Location :
Sanya
Print_ISBN :
978-1-4673-2465-6
DOI :
10.1109/MSNA.2012.6324629
