DocumentCode
1633535
Title
Defect characterization of crystalline metal oxides and high-k films by means of positron annihilation
Author
Uedono, Akira ; Ishibashi, Shoji ; Oshima, Nagayasu ; Ohdaira, Toshiyuki ; Suzuki, Ryoichi
Author_Institution
Inst. of Appl. Phys., Univ. of Tsukuba, Tsukuba, Japan
fYear
2010
Firstpage
1498
Lastpage
1501
Abstract
Point defects introduced by homoepitaxial growth of thin films on SrTiO3 substrates were studied by means of positron annihilation. The SrTiO3 films were grown by molecular-beam epitaxy (MBE) without using an oxidant. The line-shape parameter S was found to be increased by the growth of the film, which was attributed to the diffusion of oxygen from the substrate into the film, and the resultant introduction of oxygen vacancies. The impact of nitridation on open volumes in thin HfSiOx films fabricated on Si by atomic layer deposition was also studied. After plasma nitridation, the size of open volumes in the films decreased. An expansion of open volumes, however, was observed after post-nitridation annealing. The change in the size of open volumes was attributed to the trapping of nitrogen by such regions, and an incorporation of nitrogen into the amorphous matrix of HfSiOx. We will demonstrate that the positron annihilation technique is a useful tool for studies of vacancies and open volumes in metal oxides.
Keywords
atomic layer deposition; epitaxial growth; positron annihilation; amorphous matrix; atomic layer deposition; crystalline metal oxides; defect characterization; high-k films; homoepitaxial growth; molecular-beam epitaxy; point defects; positron annihilation; Annealing; Films; Metals; Nitrogen; Positrons; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667519
Filename
5667519
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