• DocumentCode
    1633733
  • Title

    Schottky barrier tuning at NiSi/Si interface using pre-silicide aluminum and sulfur co-implant

  • Author

    Tong, Yi ; Koh, Shao-Ming ; Zhou, Qian ; Du, An Yan ; Yeo, Yee-Chia

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore (NUS), Singapore, Singapore
  • fYear
    2010
  • Firstpage
    1021
  • Lastpage
    1023
  • Abstract
    In this paper, we examine the physical properties of NiSi/p-Si implanted with various combinations of aluminum (Al) and sulfur (S) doses for Schottky barrier tuning. Techniques used included HRTEM, TOF-SIMS, HAADF STEM, and EDX. We also measured the integral interfacial dose (IID) of Al and S, i.e. amount of Al and S found with 2.5 nm of the interface, and correlated it to the Schottky barrier height (SBH). For the split with the same Al and S implant dose, the SBH tuning effect of Al overwhelms that of S and the extracted SBH is 0.137 eV.
  • Keywords
    Schottky barriers; EDX; HAADF STEM; HRTEM; Schottky barrier height; Schottky barrier tuning; TOF-SIMS; integral interfacial dose; physical properties; presilicide aluminum; sulfur coimplant; Implants; Nickel; Schottky barriers; Silicides; Silicon; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667527
  • Filename
    5667527