DocumentCode :
1633733
Title :
Schottky barrier tuning at NiSi/Si interface using pre-silicide aluminum and sulfur co-implant
Author :
Tong, Yi ; Koh, Shao-Ming ; Zhou, Qian ; Du, An Yan ; Yeo, Yee-Chia
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore (NUS), Singapore, Singapore
fYear :
2010
Firstpage :
1021
Lastpage :
1023
Abstract :
In this paper, we examine the physical properties of NiSi/p-Si implanted with various combinations of aluminum (Al) and sulfur (S) doses for Schottky barrier tuning. Techniques used included HRTEM, TOF-SIMS, HAADF STEM, and EDX. We also measured the integral interfacial dose (IID) of Al and S, i.e. amount of Al and S found with 2.5 nm of the interface, and correlated it to the Schottky barrier height (SBH). For the split with the same Al and S implant dose, the SBH tuning effect of Al overwhelms that of S and the extracted SBH is 0.137 eV.
Keywords :
Schottky barriers; EDX; HAADF STEM; HRTEM; Schottky barrier height; Schottky barrier tuning; TOF-SIMS; integral interfacial dose; physical properties; presilicide aluminum; sulfur coimplant; Implants; Nickel; Schottky barriers; Silicides; Silicon; Tuning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5797-7
Type :
conf
DOI :
10.1109/ICSICT.2010.5667527
Filename :
5667527
Link To Document :
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