Title :
Antenna-on-package concept: shielding of backside radiation and study of electromagnetic near field inside package
Author :
Mestdagh, S. ; Vandenbosch, G.A.E.
Author_Institution :
Dept. of ESAT-Telemic, K.U. Leuven, Heverlee
Abstract :
In recent years a lot of research has been performed in the field of antenna integration. Very interesting is the integration of a planar radiating element in the package surrounding a chip. The electromagnetic field at the back of the antenna is not negligible, and may cause interference with the circuits in the chip, possibly encumbering the operation of the system. This interference was quantified by a numerical near field analysis, and shielding methods to reduce it were investigated
Keywords :
antenna radiation patterns; electromagnetic interference; electromagnetic shielding; antenna integration; antenna-on-package concept; backside radiation shielding methods; electromagnetic near field; numerical near field analysis; planar radiating element; Circuits; Dielectrics; Electromagnetic analysis; Electromagnetic fields; Electromagnetic radiation; Electromagnetic radiative interference; Electromagnetic shielding; Electronics packaging; Microstrip antennas; Near-field radiation pattern;
Conference_Titel :
Wireless Technology, 2005. The European Conference on
Conference_Location :
Paris
Print_ISBN :
2-9600551-1-X
DOI :
10.1109/ECWT.2005.1617703
