DocumentCode :
1635033
Title :
40nm10T SRAM cell with independent SNM WM and suppress active and leakage power
Author :
Ya-qi, Ma ; Jian-bin, Zheng ; Zhao-yong, Zhang ; Qi-shuang, Yao ; Yong, Wang ; Yi-ping, Zhang
Author_Institution :
Aicestar Technol. Corp., Suzhou, China
fYear :
2010
Firstpage :
1136
Lastpage :
1138
Abstract :
As the MOSFET´s channel length is scaling down, SRAM stability becomes the major concern for future technology. The cell becomes more susceptible to both process induced variation in device geometry and threshold voltage variability due to doping fluctuation in the channel region. In this paper, a novel highly stable 10T SRAM cell is proposed which eliminates read SNM during read and write operation The cell suppresses active power owing to avoid the half select cell bit line fighting power. It also can work at ultra-low-voltage sub-threshold operation due to transistor stacking in the Read path to reduce leakage.
Keywords :
MOSFET; SRAM chips; semiconductor doping; MOSFET; SRAM cell; SRAM stability; device geometry; doping fluctuation; independent static noise margin write margin; leakage power; leakage reduction; read operation; size 40 nm; storage capacity 10 Tbit; suppress active power; threshold voltage variability; transistor stacking; write operation; Circuit stability; Fluctuations; MOS devices; Noise; Random access memory; Thermal stability; Threshold voltage; 10T SRAM; Active power; Leakage; Low Power; Static Noise Margin; Write Margin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5797-7
Type :
conf
DOI :
10.1109/ICSICT.2010.5667575
Filename :
5667575
Link To Document :
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