• DocumentCode
    163592
  • Title

    Ion beam technologies for the 20nm technology node, 450mm wafer processes, and beyond

  • Author

    Jiong Chen ; Junhua Hong ; Jin Zhang ; Boeker, Jeff

  • Author_Institution
    Kingstone Semicond. Co., Ltd., Shanghai, China
  • fYear
    2014
  • fDate
    18-20 May 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    An innovative ion beam line capable of high ion beam current production, excellent ion mass resolving power, minimal energy contamination for sub-keV ion beams, all while maintaining high degrees of beam intensity and angle uniformity, has been designed and developed to meet ion implantation process and productivity requirements of the 20nm technology node (and beyond) and of 450mm wafers. The testing results have demonstrated that the beam line´s performance meets the required specifications in terms of ion beam current, energy purity and beam uniformities. The detailed designs and measured performance results are presented in this paper.
  • Keywords
    ion beams; ion implantation; nanotechnology; semiconductor technology; Ion beam technologies; energy contamination; energy purity; ion beam current production; ion implantation; ion mass; size 20 nm; size 450 mm; wafer processes; Abstracts; Decision support systems; Ion beams; Ion sources;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2014 International Workshop on
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/IWJT.2014.6842040
  • Filename
    6842040