DocumentCode
163592
Title
Ion beam technologies for the 20nm technology node, 450mm wafer processes, and beyond
Author
Jiong Chen ; Junhua Hong ; Jin Zhang ; Boeker, Jeff
Author_Institution
Kingstone Semicond. Co., Ltd., Shanghai, China
fYear
2014
fDate
18-20 May 2014
Firstpage
1
Lastpage
6
Abstract
An innovative ion beam line capable of high ion beam current production, excellent ion mass resolving power, minimal energy contamination for sub-keV ion beams, all while maintaining high degrees of beam intensity and angle uniformity, has been designed and developed to meet ion implantation process and productivity requirements of the 20nm technology node (and beyond) and of 450mm wafers. The testing results have demonstrated that the beam line´s performance meets the required specifications in terms of ion beam current, energy purity and beam uniformities. The detailed designs and measured performance results are presented in this paper.
Keywords
ion beams; ion implantation; nanotechnology; semiconductor technology; Ion beam technologies; energy contamination; energy purity; ion beam current production; ion implantation; ion mass; size 20 nm; size 450 mm; wafer processes; Abstracts; Decision support systems; Ion beams; Ion sources;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2014 International Workshop on
Conference_Location
Shanghai
Type
conf
DOI
10.1109/IWJT.2014.6842040
Filename
6842040
Link To Document