DocumentCode :
1635965
Title :
Corrosion characteristics of TiN prepared by plasma source ion implantation
Author :
Miki, Shigehito ; Yatsuzuka, M. ; Hashimoto, Yo ; Yamasaki, T. ; Uchida, Hironaga
Author_Institution :
Himeji Inst. of Technol., Hyogo, Japan
fYear :
1998
Firstpage :
218
Abstract :
Summary form only given. The injection of nitrogen ions into pure titanium has been performed by plasma source ion implantation with a negative voltage of 10 kV, a pulse width of 10 /spl mu/s, and a repetition rate of 100 Hz. The titanium sample (15/sup /spl phi///spl times/1.5/sup t/ mm) was immersed in a nitrogen plasma with plasma density range of 10/sup 9/ to 2/spl times/10/sup 10/ cm/sup -3/ an electron temperature of 1.4 eV, and a gas pressure of 8/spl times/10/sup -4/ Torr. A dose was changed from 10/sup 15/ to 10/sup 18/ cm/sup -2/ by varying implantation time and plasma density. The ESCA/AES analysis of nitrogen-ion implanted samples shows the deposition of nitrogen ions with a Gaussian distribution and the formation of TiN in the surface layer. Corrosion characteristics were examined by anodic polarization curves.
Keywords :
ion implantation; plasma CVD; plasma applications; plasma density; surface chemistry; titanium; 1.4 eV; 10 kV; 10 mus; 100 Hz; AES analysis; ESCA analysis; Gaussian distribution; N; N ion injection; Ti; TiN; anodic polarization curves; corrosion characteristics; deposition; electron temperature; gas pressure; implantation time; negative voltage; plasma density; plasma source ion implantation; pure Ti; repetition rate; surface layer; Corrosion; Ion implantation; Nitrogen; Plasma density; Plasma sources; Plasma temperature; Space vector pulse width modulation; Tin; Titanium; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 1998. 25th Anniversary. IEEE Conference Record - Abstracts. 1998 IEEE International on
Conference_Location :
Raleigh, NC, USA
ISSN :
0730-9244
Print_ISBN :
0-7803-4792-7
Type :
conf
DOI :
10.1109/PLASMA.1998.677731
Filename :
677731
Link To Document :
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