Title :
Simulations of ECR processing systems sustained by azimuthal microwave TE(O,n) modes
Author :
Kinder, R.L. ; Kushner, M.J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
Summary form only given. Low pressure (<5 mTorr) electron cyclotron resonance (ECR) sources are being developed for downstream etching and deposition, and production of radicals for surface treatment. The spatial coupling of microwave radiation to the plasma in these systems is a concern due to issues related to the uniformity of dissociation, electron heating, and ultimately process uniformity. To investigate these issues, we have developed a finite-difference-time-domain (FDTD) simulation for microwave injection and propagation. The FDTD simulation has been incorporated as a module in the 2-dimensional Hybrid Plasma Equipment Model (HPEM). Plasma dynamics are coupled to the electromagnetic fields through a tensor form of Ohm´s law. During each iteration through the model, the FDTD simulation uses a leap-frog scheme for time integration, with time steps that are 30% of the Courant limit, until reaching the steady state. Power deposition calculated in the FDTD module is then used in solving the electron energy equation. The system of interest uses circular TE(O,n) microwave mode fields injected along the axis of a cylindrically symmetric downstream reactor.
Keywords :
cyclotron resonance; plasma applications; plasma simulation; sputter etching; surface diffusion; surface treatment; 2-dimensional hybrid plasma equipment model; 5 mtorr; Courant limit; ECR processing systems; Ohm´s law; azimuthal microwave TE(O,n) modes; circular TE(O,n) microwave mode fields injection; cylindrically symmetric downstream reactor; deposition; dissociation; downstream etching; electromagnetic fields; electron energy equation; electron heating; finite-difference time-domain simulation; leap-frog scheme; low pressure electron cyclotron resonance sources; microwave injection; microwave propagation; microwave radiation; power deposition; process uniformity; radical production; spatial coupling; surface treatment; tensor form; time integration; time steps; Cyclotrons; Electromagnetic heating; Electrons; Etching; Finite difference methods; Plasma applications; Plasma simulation; Power system modeling; Resonance; Time domain analysis;
Conference_Titel :
Plasma Science, 1998. 25th Anniversary. IEEE Conference Record - Abstracts. 1998 IEEE International on
Conference_Location :
Raleigh, NC, USA
Print_ISBN :
0-7803-4792-7
DOI :
10.1109/PLASMA.1998.677736