• DocumentCode
    1636130
  • Title

    High rate diamond deposition using a microwave discharge

  • Author

    Huang, W.S. ; Kuo, K.P. ; Mossbrucker, J. ; Asmussen, J. ; Kahler, U. ; Engemann, J.

  • Author_Institution
    Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
  • fYear
    1998
  • Firstpage
    221
  • Abstract
    Summary form only given. Presently, plasma assisted synthesis of diamond films often employs a microwave discharge/reactor for the source of the radical species. Typical deposition takes place using varying CH/sub 4//H/sub 2//CO/sub n/ gas mixtures over a 20-100 Torr pressure regime and with a CW, 2.45 GHz input power of less than 3 kW. While excellent diamond films are synthesized under these conditions, the linear deposition rates are usually limited to only a few /spl mu/m/hr. Since diamond synthesis costs are still high, it is desirable to deposit high quality diamond films with higher deposition rates. One method to increase the diamond deposition rate is to increase the deposition pressure and discharge absorbed power density. This paper will present the results of an experimental investigation exploring microwave plasma synthesis at the 100-200 Torr pressure and 2.5-6 kW input power regimes. This work, which builds upon earlier reported work (Kuo et al., 1992, Kahler, 1997), utilizes a microwave reactor developed for operation at higher pressure/power regimes.
  • Keywords
    diamond; high-frequency discharges; high-pressure effects; plasma CVD; plasma pressure; 2.45 GHz; 20 to 100 torr; 3 kW; C; deposition pressure; diamond deposition; discharge absorbed power density; high rate deposition; input power regimes; linear deposition rates; microwave discharge; microwave reactor; plasma assisted synthesis; radical species; Costs; Fault location; Fluid flow; Inductors; Plasma density; Plasma sources; Plasma temperature; Polarization; Spectroscopy; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1998. 25th Anniversary. IEEE Conference Record - Abstracts. 1998 IEEE International on
  • Conference_Location
    Raleigh, NC, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-4792-7
  • Type

    conf

  • DOI
    10.1109/PLASMA.1998.677738
  • Filename
    677738