• DocumentCode
    1636159
  • Title

    A flexible, highly-sensitive, and easily-fabricated carbon-nanotubes tactile sensor on polymer substrate

  • Author

    Ho, ChiaHua ; Su, Wang-Shen ; Hu, Chih-Fan ; Lin, Chia-Min ; Fang, Weileun ; Yang, Fu-Liang

  • Author_Institution
    Nat. Nano Device Labs., Hsinchu, Taiwan
  • fYear
    2010
  • Firstpage
    1388
  • Lastpage
    1391
  • Abstract
    A flexible, highly-sensitive, and easily fabricated carbon nanotubes (CNTs) tactile sensor is reported in this paper. CNTs are grown and patterned on bulk-micromachined silicon substrate with 3-dimensional surface profile. After polymer molding, the CNTs with 3-dimensional distribution are successfully transferred onto a flexible PDMS with 3-dimensional tactile-bump. Advantages of presented tactile sensor are (1) exactly determine loading force by resistance change due to almost linearly current-voltage (I-V) characteristics, (2) embedded patterned CNTs into polymer using simple silicon-substrate molding process, (3) 3-dimensional distributed CNTs enable the detection of shear and normal forces, and (4) 3-dimensional polymer structure by molding as a tactile-bump. One of anisotropic-type patterned CNT approach behaves good sensing sensitivity of both normal (23%/N) and shear (18%/N) forces loading. With proper CNTs designs, tactile sensor has normal and shear forces sensitivities of up to 23%/N and 95%/N, respectively.
  • Keywords
    carbon nanotubes; electric resistance; micromachining; moulding; polymer structure; silicon; tactile sensors; 3D distribution; 3D polymer structure; 3D surface profile; 3D tactile-bump; I-V characteristics; Si; anisotropic-type patterned CNT; bulk-micromachined silicon substrate; carbon nanotube; current-voltage characteristics; flexible PDMS; loading force; polymer molding; polymer substrate; resistance change; sensing sensitivity; shear detection; silicon-substrate molding process; tactile sensor; Force; Loading; Polymers; Sensitivity; Silicon; Substrates; Tactile sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667624
  • Filename
    5667624