• DocumentCode
    163621
  • Title

    Atmospheric pressure plasma processing and layer transfer technique for thin-film device fabrication on glass and plastic substrates

  • Author

    Higashi, Seiichiro

  • Author_Institution
    Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-Hiroshima, Japan
  • fYear
    2014
  • fDate
    18-20 May 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Crystalline growth from melt during micro-thermal-plasma-jet (μ-TPJ) irradiation to amorphous silicon (a-Si) film has been directly observed by high-speed camera. Long lateral growth perpendicular to the oval-shaped liquid-solid interface results in formation of random grain boundaries (GBs). Introduction of strip pattern markedly reduces random GBs and enables single-crystalline growth at predetermined channel regions. N-and p-channel thin-film transistors (TFTs) showed high performance and small characteristic variability, and operation of 8-bit shift register at a supply voltage of 5 V with the clock frequency of 50 MHz has been achieved. In addition, we propose a local layer transfer technique utilizing meniscus force of water, which enables formation of single-crystalline silicon (100) layer on glass and polyethylene terephthalate (PET) substrates. High mobility TFTs of 1226 and 609 cm2 V-1 s-1 respectively, have been successfully fabricated on each substrate.
  • Keywords
    amorphous semiconductors; crystal growth from melt; elemental semiconductors; glass; grain boundaries; plasma materials processing; plastics; rapid thermal annealing; semiconductor thin films; silicon; thin film transistors; μ-TPJ irradiation; PET substrates; Si; TFTs; amorphous silicon film; atmospheric pressure plasma processing; crystalline growth from melt; frequency 50 MHz; glass substrates; high-speed camera; local layer transfer technique; long lateral growth; meniscus force; microthermal-plasma-jet irradiation; n-channel thin-film transistors; oval-shaped liquid-solid interface; p-channel thin-film transistors; plastic substrates; polyethylene terephthalate substrates; predetermined channel regions; random GB reduction; random grain boundaries; shift register; single-crystalline growth; single-crystalline silicon layer; small characteristic variability; strip pattern; thermal plasma jet annealing technique; thin-film device fabrication; voltage 5 V; word length 8 bit; Films; Glass; Positron emission tomography; Silicon; Strips; Substrates; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2014 International Workshop on
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/IWJT.2014.6842054
  • Filename
    6842054