DocumentCode
1636903
Title
GaN Smart Discrete power devices
Author
Chen, Kevin J. ; Zhou, Chunhua
Author_Institution
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear
2010
Firstpage
1303
Lastpage
1306
Abstract
GaN “Smart Discrete” power devices were realized using the AlGaN/GaN-on-Si platform, where two built-in intelligent self-protection functions were demonstrated. First, an AlGaN/GaN normally-off high electron mobility transistor (HEMT) with reverse drain blocking capability was realized, featuring a Schottky contact controlled drain barrier. Compared to the Schottky drain structures, the new design exhibits only a 0.55 V onset voltage in the forward biased “ON” state, while effectively blocks the reverse current conduction. The device fabrication is also free of extra photomask and process steps. Second, an AlGaN/GaN lateral field-effect rectifier (L-FER) with intrinsic “ON” state current limiting capability was fabricated, featuring a Schottky controlled depletion- mode (D-mode) channel extension (length of LD) beyond the ohmic contact at the cathode electrode, where the on-state current of the new rectifiers are self-limited at 4.59 kA/cm2 (LD = 1.3 μm) and 3.56 kA/cm2 (LD = 1.9 μm) at room temperature. The current limiting level shows a negative temperature coefficient (TC) that is desirable for thermal stability.
Keywords
III-V semiconductors; Schottky barriers; aluminium compounds; gallium compounds; high electron mobility transistors; power integrated circuits; power semiconductor devices; wide band gap semiconductors; GaN-AlGaN; Schottky contact controlled drain barrier; high electron mobility transistor; intelligent self rotection functions; lateral field-effect rectifier; smart discrete power devices; temperature coefficient; thermal stability; Aluminum gallium nitride; Anodes; Gallium nitride; HEMTs; Limiting; Logic gates; Schottky barriers;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667646
Filename
5667646
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