DocumentCode :
1637043
Title :
Highly efficient GaN power transistors and integrated circuits with high breakdown voltages
Author :
Tanaka, Tsuyoshi ; Ueda, Tetsuzo ; Ueda, Daisuke
Author_Institution :
Semicond. Device Res. Center, Panasonic Corp., Nagaokakyo, Japan
fYear :
2010
Firstpage :
1315
Lastpage :
1318
Abstract :
GaN is very promising for power switching transistors taking advantages of the high breakdown strength with high saturation electron velocity. The lateral and compact device configuration enables high speed switching with reduced on-state resistance and parasitic capacitance. In this paper, state-of-the-art device technologies of GaN transistor and its monolithic integration for switching applications are reviewed. The topics include a novel normally-off transistor called Gate Injection Transistor (GIT) fabricated on a cost-effective Si substrate, and thermally stable isolation by Fe ion implantation. These are applied for the world first monolithic GaN inverter IC for motor drive with high efficiency. The presented technologies are indispensable for wide-spread use of GaN power switching transistors in the future.
Keywords :
gallium compounds; invertors; ion implantation; iron; motor drives; power integrated circuits; power transistors; silicon; Fe; GaN; Si; breakdown strength; breakdown voltages; device configuration; gate injection transistor; ion implantation; motor drives; on-state resistance; parasitic capacitance; power integrated circuits; power switching transistors; saturation electron velocity; Gallium nitride; Insulated gate bipolar transistors; Inverters; Logic gates; Silicon; Switching circuits; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5797-7
Type :
conf
DOI :
10.1109/ICSICT.2010.5667650
Filename :
5667650
Link To Document :
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