DocumentCode
1637043
Title
Highly efficient GaN power transistors and integrated circuits with high breakdown voltages
Author
Tanaka, Tsuyoshi ; Ueda, Tetsuzo ; Ueda, Daisuke
Author_Institution
Semicond. Device Res. Center, Panasonic Corp., Nagaokakyo, Japan
fYear
2010
Firstpage
1315
Lastpage
1318
Abstract
GaN is very promising for power switching transistors taking advantages of the high breakdown strength with high saturation electron velocity. The lateral and compact device configuration enables high speed switching with reduced on-state resistance and parasitic capacitance. In this paper, state-of-the-art device technologies of GaN transistor and its monolithic integration for switching applications are reviewed. The topics include a novel normally-off transistor called Gate Injection Transistor (GIT) fabricated on a cost-effective Si substrate, and thermally stable isolation by Fe ion implantation. These are applied for the world first monolithic GaN inverter IC for motor drive with high efficiency. The presented technologies are indispensable for wide-spread use of GaN power switching transistors in the future.
Keywords
gallium compounds; invertors; ion implantation; iron; motor drives; power integrated circuits; power transistors; silicon; Fe; GaN; Si; breakdown strength; breakdown voltages; device configuration; gate injection transistor; ion implantation; motor drives; on-state resistance; parasitic capacitance; power integrated circuits; power switching transistors; saturation electron velocity; Gallium nitride; Insulated gate bipolar transistors; Inverters; Logic gates; Silicon; Switching circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667650
Filename
5667650
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