Title :
A new approach to field-plate junction termination modeling
Author :
Krizaj, D. ; Skolic, S. ; Amon, Slavko
Author_Institution :
Fac. of Electr. & Comput. Eng., Ljubljana Univ., Yugoslavia
Abstract :
Breakdown enhancement of plane junctions equipped with a field plate is investigated. Various possibilities for numerical modeling are discussed and simulation results are given, revealing an interplay between pn junction and field plate edge breakdown properties. The possibility of an additional breakdown voltage increase is found by adding a floating metal plate after the field plate edge
Keywords :
electric breakdown of solids; p-n junctions; semiconductor device models; breakdown enhancement; breakdown voltage; field plate edge breakdown; field-plate junction termination modeling; floating metal plate; numerical modeling; plane junctions; semiconductor device model; simulation; Convergence of numerical methods; Doping profiles; Electric breakdown; High performance computing; Laplace equations; Numerical models; Performance analysis; Poisson equations; Semiconductor device breakdown; Semiconductor devices;
Conference_Titel :
Electrotechnical Conference, 1991. Proceedings., 6th Mediterranean
Conference_Location :
LJubljana
Print_ISBN :
0-87942-655-1
DOI :
10.1109/MELCON.1991.161786
