A study on the structural changes and electrical properties due to 2nd heat-treatment on the polymer

Author

Wang, Jong-Bae ; Lee, Joon-Ung

Author_Institution

Div. of Urban Transit Stand., Korean Railway Res. Inst., Kyonggi, South Korea

Volume

1

fYear

1997

Firstpage

150

Abstract

The changes and stability of the structure in polymer which was varied with the ratio of additives addition and the postcuring heat-treatment have been explained through the estimation of the distributed relaxation times in the dielectric properties and the contribution of the ions at low-frequency and high-temperature regions. In the dielectric properties, the a peak related with Tg of epoxy network appeared near 130[°C], the conduction loss due to thermal dissociation of hardener above 150[°C] started off in the low frequency side below 330[Hz]. The anomalous dielectric behaviours of polymers at low frequencies and high temperature regions have been interpreted in terms of diffusion of impurity ions

Keywords

dielectric relaxation; diffusion; epoxy insulation; heat treatment; polymer structure; 130 to 150 C; 330 Hz; additive; conduction; curing; dielectric properties; epoxy polymer; glass transition temperature; hardener; heat treatment; impurity ion diffusion; relaxation time; stability; structure; thermal dissociation; Additives; Curing; Dielectric loss measurement; Dielectric losses; Frequency; Numerical analysis; Polymers; Resistance heating; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on

Conference_Location

Seoul

Print_ISBN

0-7803-2651-2

Type

conf

DOI

10.1109/ICPADM.1997.617550

Filename

617550