• DocumentCode
    1638166
  • Title

    A novel sidewall strained-Si channel nMOSFET

  • Author

    Liu, K.C. ; Wang, X. ; Quinones, E. ; Chen, X. ; Chen, X.D. ; Kencke, D. ; Anantharam, B. ; Chang, R.D. ; Ray, S.K. ; Oswal, S.K. ; Tu, C.Y. ; Banerjee, S.K.

  • Author_Institution
    Microelectron. Res. Center, Texas Univ., Austin, TX, USA
  • fYear
    1999
  • Firstpage
    63
  • Lastpage
    66
  • Abstract
    We fabricated a novel vertical sidewall strained-Si device without relaxed SiGe buffer layers in this work. The electrical performance has been characterized using C-V and I-V measurement. TEM pictures show a high quality crystalline tensile-strained-Si layer grown on the sidewall of a compressively-strained SiGe layer. The transconductance measurements of sidewall-tensile-strained Si n-MOSFETs exhibit the role of enhanced electron mobility as tensile strain increases. In addition to device results, theoretical sidewall conduction and valence band offset calculations, relative to the strained SiGe layer, are also presented.
  • Keywords
    MOSFET; capacitance; electron mobility; internal stresses; semiconductor device measurement; semiconductor device models; transmission electron microscopy; valence bands; C-V measurement; I-V measurement; SiGe-Si; TEM pictures; compressively-strained SiGe layer; electrical performance; enhanced electron mobility; high quality crystalline tensile-strained-Si layer; sidewall conduction; tensile strain; transconductance measurements; valence band offset; vertical sidewall strained-Si channel nMOSFET; Buffer layers; Capacitance-voltage characteristics; Crystallization; Electric variables measurement; Electron mobility; Germanium silicon alloys; MOSFET circuits; Silicon germanium; Strain measurement; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-5410-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1999.823847
  • Filename
    823847