DocumentCode
1638166
Title
A novel sidewall strained-Si channel nMOSFET
Author
Liu, K.C. ; Wang, X. ; Quinones, E. ; Chen, X. ; Chen, X.D. ; Kencke, D. ; Anantharam, B. ; Chang, R.D. ; Ray, S.K. ; Oswal, S.K. ; Tu, C.Y. ; Banerjee, S.K.
Author_Institution
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
fYear
1999
Firstpage
63
Lastpage
66
Abstract
We fabricated a novel vertical sidewall strained-Si device without relaxed SiGe buffer layers in this work. The electrical performance has been characterized using C-V and I-V measurement. TEM pictures show a high quality crystalline tensile-strained-Si layer grown on the sidewall of a compressively-strained SiGe layer. The transconductance measurements of sidewall-tensile-strained Si n-MOSFETs exhibit the role of enhanced electron mobility as tensile strain increases. In addition to device results, theoretical sidewall conduction and valence band offset calculations, relative to the strained SiGe layer, are also presented.
Keywords
MOSFET; capacitance; electron mobility; internal stresses; semiconductor device measurement; semiconductor device models; transmission electron microscopy; valence bands; C-V measurement; I-V measurement; SiGe-Si; TEM pictures; compressively-strained SiGe layer; electrical performance; enhanced electron mobility; high quality crystalline tensile-strained-Si layer; sidewall conduction; tensile strain; transconductance measurements; valence band offset; vertical sidewall strained-Si channel nMOSFET; Buffer layers; Capacitance-voltage characteristics; Crystallization; Electric variables measurement; Electron mobility; Germanium silicon alloys; MOSFET circuits; Silicon germanium; Strain measurement; Transconductance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-5410-9
Type
conf
DOI
10.1109/IEDM.1999.823847
Filename
823847
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