Title :
New concept of a high-speed low-power digital interface for multi-standard mobile transceiver RFIC´s in 0.13 /spl mu/m CMOS
Author :
Chabrak, K. ; Bachman, F. ; Hueber, G. ; Maurer, L. ; Weigel, R.
Author_Institution :
Inst. for Electron. Eng., Erlangen-Nurnberg Univ., Erlangen
Abstract :
In this paper a new concept of a high-speed low power digital interface between the RF and the base-band chip of a multi-standard mobile phone is presented and compared to other popular interfaces. First, the requirements on a digital interface at the digital output of a multi-standard mobile phone RF front-end are explained. The paper gives an insight of popular digital interfaces and presents a new concept which is more robust against the ground bounce effect. We also show measurement results of a realized test chip that show functionality and benefits of the new concept
Keywords :
CMOS integrated circuits; mobile handsets; radiofrequency integrated circuits; transceivers; 0.13 mum; CMOS; RFIC; base-band chip; ground bounce effect; high-speed low-power digital interface; multistandard mobile phone; multistandard mobile transceiver; CMOS digital integrated circuits; CMOS integrated circuits; Capacitance; Crosstalk; High speed integrated circuits; Power engineering and energy; Radio frequency; Transceivers; Voltage; Wires;
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2005. MAPE 2005. IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
0-7803-9128-4
DOI :
10.1109/MAPE.2005.1617904
